, etc. Conduct the thermal, mechanical stress, and vibration analysis of electro-mechanical enclosures, heat exchange mechanisms... using thermal and stress analysis software is required AutoDesk Inventor and AutoCAD preferred Experience with PCB...
Dover Corporation, etc. Conduct the thermal, mechanical stress, and vibration analysis of electro-mechanical enclosures, heat exchange mechanisms... and structural analysis, and electro-mechanical packaging required, NASTRAN is preferred Experience using thermal and stress...
Dover Corporation, etc. Conduct the thermal, mechanical stress, and vibration analysis of electro-mechanical enclosures, heat exchange mechanisms... and structural analysis, and electro-mechanical packaging required, NASTRAN is preferred Experience using thermal and stress...
Dover Corporation